


Cross Sectioning for Other Interfaces ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Other Interfaces ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
181 results found for Other Interfaces/Communication-Interface/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
MSOP-8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQFP-68
HIREL RT PLASTIC
Not qualified
NOT LISTED IN QPL
Surface Mount
VQFN-68
QML V EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-68
PROTO
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-14
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SOIC-14
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-16
QML V
Not qualified
QPDSIS-38535
Surface Mount
CFP-14
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-8
Part validation activities
Cost & Activity Matrix