Servicio Familia 
Bond Pull Test for Optocouplers Hybrids
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Optocouplers Hybrids
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
268 results found for Optocouplers Hybrids/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
QML K
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-16
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-8
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-8
QML K
Not qualified
QPDSIS-38534
Through Hole Mount
CDIP-8
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-8
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-8
QML K
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-8
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-8
QML E
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-8
QML K
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-16
Part validation activities
Cost & Activity Matrix