


Bond Pull Test for Non-Latching Relays
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Non-Latching Relays
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
7070 results found for Non-Latching/Electromagnetic/Relays
Part reference
Quality level / QPL
Package
Contact Configuration
Coil Supression Diode
DC Rated Current
Rated Coil Resistance
Rated Coil Voltage
Unit price
Lead time
FAILURE RATE P
Qualified
QPDSIS-39016
Through Hole Mount
TO-5
DPDT
With
1A
78R
6V
FAILURE RATE M
Qualified
QPDSIS-39016
Through Hole Mount
TO-5
DPDT
Without
1A
400R
9V
FAILURE RATE P
Qualified
QPDSIS-39016
Through Hole Mount
TO-5
SPDT
With
1A
630R
9V
FAILURE RATE M
Qualified
QPDSIS-39016
Through Hole Mount
TO-5
DPDT
With
1A
220R
9V
FAILURE RATE L
Qualified
QPDSIS-39016
Through Hole Mount
TO-5
DPDT
With
1A
390R
12V
FAILURE RATE L
Qualified
QPDSIS-39016
Through Hole Mount
TO-5
DPDT
Without
1A
880R
18V
FAILURE RATE L
Qualified
QPDSIS-39016
Through Hole Mount
TO-5 (With Spreader Pad)
DPDT
With
1A
800R
12V
FAILURE RATE L
Qualified
QPDSIS-39016
Through Hole Mount
TO-5 (With Spreader Pad)
DPDT
With
1A
220R
9V
FAILURE RATE L
Qualified
QPDSIS-39016
Through Hole Mount
TO-5
DPDT
With
1A
800R
12V
FAILURE RATE M
Qualified
QPDSIS-39016
Through Hole Mount
TO-5 (With Spreader Pad)