


Cross Sectioning for Network Arrays Resistors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Network Arrays Resistors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
401818 results found for Network Arrays/Resistors
Part reference
Quality level / QPL
Package
Power Rating
Resistance [Nom]
Temperature Coefficient of Resistance
Tolerance
Unit price
Lead time
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
100mW
626K
±10ppm/ºC
±0,5%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
100mW
74K4
±10ppm/ºC
±0,5%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
100mW
684K
±10ppm/ºC
±0,5%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
100mW
6K17
±10ppm/ºC
±1%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
100mW
36K3
±10ppm/ºC
±0,5%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
100mW
918K
±10ppm/ºC
±1%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
100mW
685K
±10ppm/ºC
±0,5%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
100mW
999K
±10ppm/ºC
±0,5%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
100mW
84K3
±10ppm/ºC
±1%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip