


Cross Sectioning for Network Arrays Resistors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Network Arrays Resistors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
401818 results found for Network Arrays/Resistors
Part reference
Quality level / QPL
Package
Power Rating
Resistance [Nom]
Temperature Coefficient of Resistance
Tolerance
Unit price
Lead time
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
SIL-6
500mW
1K33
±150ppm/ºC
±2%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
SIL-10
900mW
2K37
±150ppm/ºC
±2%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
SIL-6
500mW
2K26
±150ppm/ºC
±2%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
SIL-8
700mW
402R
±150ppm/ºC
±2%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
SIL-6
500mW
215K
±150ppm/ºC
±2%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
SIL-8
700mW
110R
±150ppm/ºC
±2%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
SIL-8
700mW
36K5
±150ppm/ºC
±2%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
SIL-6
500mW
562K
±150ppm/ºC
±2%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
SIL-8
700mW
4K22
±150ppm/ºC
±2%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
SIL-9