


Cross Sectioning for NTC Thermistors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for NTC Thermistors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
26008 results found for NTC/Thermistors
Part reference
Quality level / QPL
Package
Resistance [Nom]
Tolerance
Unit price
Lead time
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
549K
±1%
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
Through Hole Mount
Radial bead
10K
±0,81%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
2K7
±3%
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
Through Hole Mount
Radial bead
2K252
±0,44%
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
Through Hole Mount
Radial bead
5K
±0,88%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
4K22
±1%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
82K
±2%
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
Through Hole Mount
Radial bead
10K
±0,4%
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
Through Hole Mount
Radial bead
2K252
±0,44%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
4K87
±1%
Part validation activities
Cost & Activity Matrix