


Cross Sectioning for NTC Thermistors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for NTC Thermistors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
26008 results found for NTC/Thermistors
Part reference
Quality level / QPL
Package
Resistance [Nom]
Tolerance
Unit price
Lead time
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
Through Hole Mount
Radial bead
3K
±0,88%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
68K
±5%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
38K3
±1%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
21K
±1%
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
Through Hole Mount
Radial bead
10K
±0,81%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
64K9
±1%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
1K02
±1%
NASA SCREENING LEVEL1
Qualified
GSFC-311-QPLD
Through Hole Mount
Radial bead
10K
±0,4%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
31K6
±1%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
3K
±3%
Part validation activities
Cost & Activity Matrix