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Bond Pull Test for N-channel JFET
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for N-channel JFET
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
306 results found for N-channel JFET/JFET/FET/Transistor/Discretes
Part reference
Quality level / QPL
Package
Power Dissipation [Max]
TID (krads)
Drain Current [Max]
Drain-Source Voltage [Max]
Unit price
Lead time
JAN
Qualified
QPDSIS-19500
Surface Mount
LCC-4 (UB)
400mW
80mA
40V
JANTX
Not qualified
QPDSIS-19500
Through Hole Mount
TO-72
300mW
20mA
30V
JANTX
Not qualified
QPDSIS-19500
Surface Mount
LCC-4 (UB)
400mW
80mA
30V
JANTX
Qualified
QPDSIS-19500
Surface Mount
LCC-4 (UB)
400mW
100mA
40V
JANTXV
Qualified
QPDSIS-19500
Surface Mount
LCC-4 (UB)
400mW
100mA
40V
JANTX
Qualified
QPDSIS-19500
Through Hole Mount
TO-206AA (TO-18)
360mW
175mA
30V
JANTX
Not qualified
QPDSIS-19500
Through Hole Mount
TO-206AA (TO-18)
360mW
100mA
30V
JAN
Qualified
QPDSIS-19500
Surface Mount
LCC-4 (UB)
400mW
80mA
30V
JANTXV
Not qualified
QPDSIS-19500
Through Hole Mount
TO-206AA (TO-18)
360mW
15mA
40V
JANTX
Not qualified
QPDSIS-19500
Through Hole Mount
TO-206AA (TO-18)
360mW
80mA
40V
Part validation activities
Cost & Activity Matrix