Skip to Content
  • Resources
    • COTS For Space WEBINARS
    • EEE Components
    • SPECIFICATIONS / QPLs
    • Events / Webinars
    • Space Talks
    • Tech Articles
    • Manufacturer Notifications
  • Laboratory Services
    • Laboratory Standard Testing
    • Non Standard Testing
    • Silicon Carbide -SiC- Diodes
    • CrowdTesting
    • Optoelectronics
    • Small Sats
    • Representative Projects / Papers
  • Additional Services
    • Industry 4.0 Cybersecurity (IEC 62443) NEW
    • Penetration Test NEW
    • Cybersecurity Certified (CSC) NEW
    • Code Score Matrix NEW
    • Long-term storage of wafers
    • Electronic Design
  • Tools
    • Comparator
    • MYDCLs / BOMs
    • esa-stockplace
  • About Us
  • Proposal Next
  • Sign In
Cookies on the doEEEt website. We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies on the doEEEt website. However, if you would like to, you can change your cookie settings at any time. Link to cookies policy.
doEEEt Bond Pull Test for N-channel JFET | doEEEt.com
  • Home
  • How does doEEEt works
  • About us
  • Contact Us
  • Terms of Use
  • Disclaimer
  • Privacy Policy
  • Privacy Policy and Legal Notice
  • Cookie Policy
  • Copyright
  • autosignup2
  • Instant Quote
  • Introducing NanoXplore And Its European FPGA’s ITAR Free
  • Space Talks 3 - Dan Friedlander
  • autosignup3
  • Shopping Cart
  • wpo
  • Data Protection
  • Components
  • Documents
Please enter at least one character to search
ALTER Laboratory Services
Servicio Familia Servicio Familia
Image
Image

Bond Pull Test for N-channel JFET

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

Fill the form to receive expert assistance from our skilled engineers and technicians

Read Policy

Related content

X-Ray Inspection applied to DPA test

Non-destructive internal inspection of EEE parts and passive components

electrical testing

Alter Technology SAM Additional Testing Capabilities

procurement-EEE-Parts

Reasons to do an Element Evaluation Procedure of EEE Parts

EEE Parts Results Page

Bond Pull Test for N-channel JFET

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

Applications expected requirements
Category
Category
Recommended
More...
Close
  • Discretes
    • Transistor
      • FET
        • JFET
          • N-channel JFET

306 results found for N-channel JFET/JFET/FET/Transistor/Discretes

Reset
Part reference
Quality level / QPL
TOP
Package
Power Dissipation [Max]
TID (krads)
Drain Current [Max]
Drain-Source Voltage [Max]
Unit price
Lead time

JANTXV2N4857
2N4857 TO-206AA (TO-18)
VPT Components
MIL-PRF-19500/385

Compare DCL / BOM Cart
JANTXV
Qualified
QPDSIS-19500
-65ºC to +150ºC
Through Hole Mount
TO-206AA (TO-18)
360mW
100mA
40V

JAN2N4861UB
2N4861UB LCC-4 (UB)
Microsemi a Microchip Company
MIL-PRF-19500/385

Compare DCL / BOM Cart
JAN
Not qualified
QPDSIS-19500
-65ºC to +150ºC
Surface Mount
LCC-4 (UB)
400mW
80mA
30V

JANTXV2N4856UB
2N4856UB LCC-4 (UB)
VPT Components
MIL-PRF-19500/385

Compare DCL / BOM Cart
JANTXV
Qualified
QPDSIS-19500
-65ºC to +150ºC
Surface Mount
LCC-4 (UB)
400mW
175mA
40V

JANTXVD2N4858UB
2N4858UB LCC-4 (UB)
VPT Components
MIL-PRF-19500/385

Compare DCL / BOM Cart
JANTXV
Qualified
QPDSIS-19500
-65ºC to +150ºC
Surface Mount
LCC-4 (UB)
400mW
TID (HDR): 10.0
80mA
40V

JANTXVM2N4857
2N4857 TO-206AA (TO-18)
VPT Components
MIL-PRF-19500/385

Compare DCL / BOM Cart
JANTXV
Qualified
QPDSIS-19500
-65ºC to +150ºC
Through Hole Mount
TO-206AA (TO-18)
360mW
TID (HDR): 3.0
100mA
40V

JANTXVR2N4856UB
2N4856UB LCC-4 (UB)
VPT Components
MIL-PRF-19500/385

Compare DCL / BOM Cart
JANTXV
Qualified
QPDSIS-19500
-65ºC to +150ºC
Surface Mount
LCC-4 (UB)
400mW
TID (HDR): 100.0
175mA
40V

JANTXVL2N4858
2N4858 TO-206AA (TO-18)
VPT Components
MIL-PRF-19500/385

Compare DCL / BOM Cart
JANTXV
Qualified
QPDSIS-19500
-65ºC to +150ºC
Through Hole Mount
TO-206AA (TO-18)
360mW
TID (HDR): 50.0
80mA
40V

JANTXVL2N4860
2N4860 TO-206AA (TO-18)
VPT Components
MIL-PRF-19500/385

Compare DCL / BOM Cart
JANTXV
Qualified
QPDSIS-19500
-65ºC to +150ºC
Through Hole Mount
TO-206AA (TO-18)
360mW
TID (HDR): 50.0
100mA
30V

JANTXV2N4857
2N4857 TO-206AA (TO-18)
Vishay Siliconix
MIL-PRF-19500/385

Compare DCL / BOM Cart
JANTXV
Not qualified
QPDSIS-19500
-65ºC to +150ºC
Through Hole Mount
TO-206AA (TO-18)
360mW
100mA
40V

JANTXV2N5547
2N5547 TO-71
Solitron
MIL-PRF-19500/430

Compare DCL / BOM Cart
JANTXV
Not qualified
QPDSIS-19500
-65ºC to +150ºC
Through Hole Mount
TO-71
250mW
8mA
Part validation activities
Cost & Activity Matrix
  • <
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • >
Alter Technology Laboratory Services
  • Screening
  • Evaluation/Qualification
  • Scanning Acoustic Microscopy
  • RF/Microwave
  • Incoming Inspection
  • DPA

EEE Components
  • Capacitors
  • Microcircuits
  • Resistors
  • Crystals and Oscillators
  • Schottky Barrier Rectifiers
  • Discretes

Laboratory Success Cases
  • GRACE Project
  • XRAY, SAM and Cross Section
  • SiC schottky Diode
  • JUICE Case
  • Deimos Neptuno
  • Melissa III

Company
  • About Us
  • Contact-us
  • How does doEEEt works?
Security & Privacity
  • Privacy Policy and Legal Notice
  • Copyright
  • Contact Clause
  • LinkedIn LinkedIn
  • Twitter Twitter
Copyright © 2025 ALTER TECHNOLOGY TÜV NORD S.A.U
All rights reserved.