


Cross Sectioning for Modulator-Demodulator ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Modulator-Demodulator ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
6 results found for Modulator-Demodulator/Control/RF-Microwave Microcircuits/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-16
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-20
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
LFCSP-24
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-16
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-16
Part validation activities
Cost & Activity Matrix