


Cross Sectioning for Microprocessor
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Microprocessor
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
459 results found for Microprocessor/Processor/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Clock Frequency [Max]
Million Instruction per Second
Number of Bits
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQFP-132 (Gull Wing)
25MHz
32-Bits
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-44
12MHz
8-Bits
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CCGA-255
TID (HDR): 100.0
SEL (Let): 120.0
132MHz
883
Qualified
QPDSIS-38535
Surface Mount
CFP-64 (Gull Wing)
30MHz
1,9MIPS
16-Bits
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CPGA-68
33,33MHz
32-Bits
QML Q
Qualified
QPDSIS-38535
Surface Mount
CLGA-484
TID (HDR): 100.0
SEL (Let): 108.0
SEU (Let): 54.0
66MHz
92MIPS
32-Bits
QML Q
Qualified
QPDSIS-38535
Surface Mount
CCGA-145
TID (HDR): 500.0
SEL (Let): 55.0
SEU (Let): 55.0
16MHz
6MIPS
32-Bits
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CPGA-114
20MHz
32-Bits
883
Qualified
QPDSIS-38535
Surface Mount
CQFP-68 (Gull Wing)