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Cross Sectioning for Microprocessor

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

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EEE Parts Results Page

Cross Sectioning for Microprocessor

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

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  • Microcircuits
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      • Processor
        • Microprocessor

473 results found for Microprocessor/Processor/Digital/Microcircuits

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Part reference
Quality level / QPL
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Package
TID (krads)
SEE (MeV/mg/cm2)
Clock Frequency [Max]
Million Instruction per Second
Number of Bits
Unit price
Lead time

5962-8766507UA
P1750AE-40QLMB
Pyramid Semiconductor
5962-87665

Compare DCL / BOM Cart
883
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQFP-68
40MHz
2,6MIPS
16-Bits

5962-8853503QC
GEM32003QQC
SRI International formerly Sarnoff
5962-88535

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-40
28MHz
4-Bits

5962H1222905QXA
8447257-2234
BAE Systems
5962-12229

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CCGA-255
TID (HDR): 1000.0
SEL (Let): 120.0
200MHz

5962-9314302MYC
TS68040MFTB/C33A
Teledyne e2v Semiconductors
5962-93143

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQFP-196
33MHz
32-Bits

5962-8946301XC
TS68882MRB/C16
Teledyne e2v Semiconductors
5962-89463

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CPGA-68
16,67MHz
32-Bits

5962-8603205YA
TS68020MF1B/C33
Teledyne e2v Semiconductors
5962-86032

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQFP-132 (Gull Wing)
33,33MHz
32-Bits

5962-8946302YA
TS68882MF1B/C20
Teledyne e2v Semiconductors
5962-89463

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQFP-68 (Gull Wing)
20MHz
32-Bits

5962F07A0103VXC
22031940-008
Honeywell Aerospace
5962-07A01

Compare DCL / BOM Cart
QML V
Qualified
QPDSIS-38535
not available
Surface Mount
CQFP-240
TID (HDR): 300.0

5962-8946302XA
TS68882MR1B/C20
Teledyne e2v Semiconductors
5962-89463

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CPGA-68
20MHz
32-Bits

5962-9162303MXA
SMJ34020AGBM32
Texas Instruments
5962-91623

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CPGA-145
Part validation activities
Cost & Activity Matrix
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