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Bond Pull Test for Microcontroller
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Microcontroller
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
403 results found for Microcontroller/Processor/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Clock Frequency [Max]
Number of Bits
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQCC-44 (J-Lead)
12MHz
8-Bits
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
HLQFP-176
200MHz
32-Bits
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
TSSOP-14
16MHz
16-Bits
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-40
12MHz
8-Bits
HIREL RT PLASTIC
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-144
TID (HDR): 30.0
SEL (Let): 62.0
84MHz
32-Bits
HIREL RT PLASTIC
Not qualified
NOT LISTED IN QPL
Surface Mount
TQFP-64
TID (HDR): 30.0
SEL (Let): 63.0
8MHz
8-Bits
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CPGA-68
12MHz
16-Bits
PLASTIC MLS
Not qualified
NOT LISTED IN QPL
Surface Mount
HTQFP-48
TID (HDR): 50.0
SEL (Let): 72.0
16MHz
16-Bits
HIREL RT PLASTIC
Not qualified
NOT LISTED IN QPL
Surface Mount
PBGA-196
TID (HDR): 200.0
SEL (Let): 110.0
100MHz
32-Bits
QML Q EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-256
TID (HDR): 100.0
SEL (Let): 78.0
100MHz
32-Bits
Part validation activities
Cost & Activity Matrix