Skip to Content
  • Resources
    • COTS For Space WEBINARS
    • EEE Components
    • SPECIFICATIONS / QPLs
    • Events / Webinars
    • Space Talks
    • Tech Articles
    • Manufacturer Notifications
  • Laboratory Services
    • Laboratory Standard Testing
    • Non Standard Testing
    • Silicon Carbide -SiC- Diodes
    • CrowdTesting
    • Optoelectronics
    • Small Sats
    • Representative Projects / Papers
  • Additional Services
    • Industry 4.0 Cybersecurity (IEC 62443) NEW
    • Penetration Test NEW
    • Cybersecurity Certified (CSC) NEW
    • Code Score Matrix NEW
    • Long-term storage of wafers
    • Electronic Design
  • Tools
    • Comparator
    • MYDCLs / BOMs
    • esa-stockplace
  • About Us
  • Proposal Next
  • Sign In
Cookies on the doEEEt website. We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies on the doEEEt website. However, if you would like to, you can change your cookie settings at any time. Link to cookies policy.
doEEEt Cross Sectioning for Mica Capacitors | doEEEt.com
  • Home
  • How does doEEEt works
  • About us
  • Contact Us
  • Terms of Use
  • Disclaimer
  • Privacy Policy
  • Privacy Policy and Legal Notice
  • Cookie Policy
  • Copyright
  • autosignup2
  • Instant Quote
  • Introducing NanoXplore And Its European FPGA’s ITAR Free
  • Space Talks 3 - Dan Friedlander
  • autosignup3
  • Shopping Cart
  • wpo
  • Data Protection
  • Components
  • Documents
Please enter at least one character to search
ALTER Laboratory Services
Servicio Familia Servicio Familia
Image
Image

Cross Sectioning for Mica Capacitors

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

Fill the form to receive expert assistance from our skilled engineers and technicians

Read Policy

Related content

Microsection images.

Test combination for detecting defects in plastic ICs

Importance of SAM for delamination detection

Importance of the SAM for delamination detection

C-Sam-internal-inspection-

SAM Capabilities, Analyse the internal structure in EEE Parts

Microsection Inspection - Failure Analysis

Failure Analysis in Microsection Inspection

Constructional Analysis

Constructional Analysis in Microsection Inspection

EEE Parts Results Page

Cross Sectioning for Mica Capacitors

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

Applications expected requirements
Category
Category
Recommended
More...
Close
  • Capacitors
    • Mica

4006 results found for Mica/Capacitors

Reset
Part reference
Quality level / QPL
TOP
Package
Capacitance [Nom]
DC Rated Voltage
Temperature Coefficient of Capacitance
Tolerance
Unit price
Lead time

CMR04F161FPDM
CMR04 160pF 1% 500V 0ppm/ºC to 70ppm/ºC Radial
Cornell Dubilier
MIL-PRF-39001/5

Compare DCL / BOM Cart
FAILURE RATE M
Qualified
QPDSIS-39001
Through Hole Mount
Radial
160pF
500V
(0 to +70)ppm/ºC
±1%

CMR06F112FODP
CMR06 1,1nF 1% 500V 0ppm/ºC to 70ppm/ºC Radial
Cornell Dubilier
MIL-PRF-39001/5

Compare DCL / BOM Cart
FAILURE RATE P
Qualified
QPDSIS-39001
Through Hole Mount
Radial
1,1nF
500V
(0 to +70)ppm/ºC
±1%

CMR05F181JODR
CMR05 180pF 5% 500V 0ppm/ºC to 70ppm/ºC Radial
Cornell Dubilier
MIL-PRF-39001/5

Compare DCL / BOM Cart
FAILURE RATE R
Qualified
QPDSIS-39001
Through Hole Mount
Radial
180pF
500V
(0 to +70)ppm/ºC
±5%

CMR05F121FODM
CMR05 120pF 1% 500V 0ppm/ºC to 70ppm/ºC Radial
Cornell Dubilier
MIL-PRF-39001/5

Compare DCL / BOM Cart
FAILURE RATE M
Qualified
QPDSIS-39001
Through Hole Mount
Radial
120pF
500V
(0 to +70)ppm/ºC
±1%

CMR07F103FPDP
CMR07 10nF 1% 500V 0ppm/ºC to 70ppm/ºC Radial
Cornell Dubilier
MIL-PRF-39001/5

Compare DCL / BOM Cart
FAILURE RATE P
Qualified
QPDSIS-39001
Through Hole Mount
Radial
10nF
500V
(0 to +70)ppm/ºC
±1%

CMR06F222FPDM
CMR06 2,2nF 1% 500V 0ppm/ºC to 70ppm/ºC Radial
Cornell Dubilier
MIL-PRF-39001/5

Compare DCL / BOM Cart
FAILURE RATE M
Qualified
QPDSIS-39001
Through Hole Mount
Radial
2,2nF
500V
(0 to +70)ppm/ºC
±1%

CMR03E430GOYR
CMR03 43pF 2% 50V -20ppm/ºC to 100ppm/ºC Radial
Cornell Dubilier
MIL-PRF-39001/5

Compare DCL / BOM Cart
FAILURE RATE R
Qualified
QPDSIS-39001
Through Hole Mount
Radial
43pF
50V
(-20 to +100)ppm/ºC
±2%

CMR04F301FOCR
CMR04 300pF 1% 300V 0ppm/ºC to 70ppm/ºC Radial
Cornell Dubilier
MIL-PRF-39001/5

Compare DCL / BOM Cart
FAILURE RATE R
Qualified
QPDSIS-39001
Through Hole Mount
Radial
300pF
300V
(0 to +70)ppm/ºC
±1%

CMR04E680FPDR
CMR04 68pF 1% 500V -20ppm/ºC to 100ppm/ºC Radial
Cornell Dubilier
MIL-PRF-39001/5

Compare DCL / BOM Cart
FAILURE RATE R
Qualified
QPDSIS-39001
Through Hole Mount
Radial
68pF
500V
(-20 to +100)ppm/ºC
±1%

CMR04F910FODP
CMR04 91pF 1% 500V 0ppm/ºC to 70ppm/ºC Radial
Cornell Dubilier
MIL-PRF-39001/5

Compare DCL / BOM Cart
FAILURE RATE P
Qualified
QPDSIS-39001
Through Hole Mount
Radial
91pF
500V
(0 to +70)ppm/ºC
±1%
Part validation activities
Cost & Activity Matrix
  • <
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • >
Alter Technology Laboratory Services
  • Screening
  • Evaluation/Qualification
  • Scanning Acoustic Microscopy
  • RF/Microwave
  • Incoming Inspection
  • DPA

EEE Components
  • Capacitors
  • Microcircuits
  • Resistors
  • Crystals and Oscillators
  • Schottky Barrier Rectifiers
  • Discretes

Laboratory Success Cases
  • GRACE Project
  • XRAY, SAM and Cross Section
  • SiC schottky Diode
  • JUICE Case
  • Deimos Neptuno
  • Melissa III

Company
  • About Us
  • Contact-us
  • How does doEEEt works?
Security & Privacity
  • Privacy Policy and Legal Notice
  • Copyright
  • Contact Clause
  • LinkedIn LinkedIn
  • Twitter Twitter
Copyright © 2025 ALTER TECHNOLOGY TÜV NORD S.A.U
All rights reserved.