Skip to Content
  • Resources
    • COTS For Space WEBINARS
    • EEE Components
    • SPECIFICATIONS / QPLs
    • Events / Webinars
    • Space Talks
    • Tech Articles
    • Manufacturer Notifications
  • Laboratory Services
    • Laboratory Standard Testing
    • Non Standard Testing
    • Silicon Carbide -SiC- Diodes
    • CrowdTesting
    • Optoelectronics
    • Small Sats
    • Representative Projects / Papers
  • Additional Services
    • Industry 4.0 Cybersecurity (IEC 62443) NEW
    • Penetration Test NEW
    • Cybersecurity Certified (CSC) NEW
    • Code Score Matrix NEW
    • Long-term storage of wafers
    • Electronic Design
  • Tools
    • Comparator
    • MYDCLs / BOMs
    • esa-stockplace
  • About Us
  • Proposal Next
  • Sign In
Cookies on the doEEEt website. We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies on the doEEEt website. However, if you would like to, you can change your cookie settings at any time. Link to cookies policy.
doEEEt Cross Sectioning for Metal Foil Resistors | doEEEt.com
  • Home
  • How does doEEEt works
  • About us
  • Contact Us
  • Terms of Use
  • Disclaimer
  • Privacy Policy
  • Privacy Policy and Legal Notice
  • Cookie Policy
  • Copyright
  • autosignup2
  • Instant Quote
  • Introducing NanoXplore And Its European FPGA’s ITAR Free
  • Space Talks 3 - Dan Friedlander
  • autosignup3
  • Shopping Cart
  • wpo
  • Data Protection
  • Components
  • Documents
Please enter at least one character to search
ALTER Laboratory Services
Servicio Familia Servicio Familia
Image
Image

Cross Sectioning for Metal Foil Resistors

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

Fill the form to receive expert assistance from our skilled engineers and technicians

Read Policy

Related content

Microsection images.

Test combination for detecting defects in plastic ICs

Importance of SAM for delamination detection

Importance of the SAM for delamination detection

C-Sam-internal-inspection-

SAM Capabilities, Analyse the internal structure in EEE Parts

Microsection Inspection - Failure Analysis

Failure Analysis in Microsection Inspection

Constructional Analysis

Constructional Analysis in Microsection Inspection

EEE Parts Results Page

Cross Sectioning for Metal Foil Resistors

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

Applications expected requirements
Category
Category
Recommended
More...
Close
  • Resistors
    • Metal Foil

164887 results found for Metal Foil/Resistors

Reset
Part reference
Quality level / QPL
TOP
Package
Power Rating
Resistance [Nom]
Temperature Coefficient of Resistance
Tolerance
Unit price
Lead time

400102802R082F
SMV-PW R082 ±1% ±30ppm (NOT MANUFACTURED)
Isabellenhuette
ESCC 4001/028

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +140ºC
Surface Mount
Chip
4723 (11958 Metric)
3W
R082
±30ppm/ºc
±1%

400102802R0047D
SMV-PW R0047 ±0,5% ±50ppm (NOT MANUFACTURED)
Isabellenhuette
ESCC 4001/028

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +140ºC
Surface Mount
Chip
4723 (11958 Metric)
3W
R0047
50ppm/ºC
±0,5%

4001027031R50D
SMT-PW 1R50 ±0,5% ±50ppm (NOT MANUFACTURED)
Isabellenhuette
ESCC 4001/027

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +170ºC
Surface Mount
Chip
2817 (7143 Metric)
3W
1R50
50ppm/ºC
±0,5%

400102701R027D
SMP-PW R027 ±0,5% ±50ppm/ºC Chip 2010
Isabellenhuette
ESCC 4001/027

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +170ºC
Surface Mount
Chip
2010 (5025 Metric)
1W
R027
50ppm/ºC
±0,5%

400102702R270D
SMS-PW R270 ±0,5% ±50ppm (NOT MANUFACTURED)
Isabellenhuette
ESCC 4001/027

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +170ºC
Surface Mount
Chip
2512 (6432 Metric)
2W
R270
50ppm/ºc
±0,5%

400102801R560D
SMR-PW R56 0,5% ±50ppm/ºC Chip 4723
Isabellenhuette
ESCC 4001/028

Compare DCL / BOM Cart
ESCC
Not qualified
ESCC QPL
-55ºC to +140ºC
Surface Mount
Chip
4723 (11958 Metric)
3W
R56
50ppm/ºC
±0,5%

400102701R056D
SMP-PW R056 ±0,5% ±50ppm/ºC Chip 2010
Isabellenhuette
ESCC 4001/027

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +170ºC
Surface Mount
Chip
2010 (5025 Metric)
1W
R056
50ppm/ºC
±0,5%

400102702R056D
SMS-PW R056 ±0,5% ±50ppm (NOT MANUFACTURED)
Isabellenhuette
ESCC 4001/027

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +170ºC
Surface Mount
Chip
2512 (6432 Metric)
2W
R056
50ppm/ºc
±0,5%

400102801R018F
SMR-PW R018 1% ±50ppm/ºC Chip 4723
Isabellenhuette
ESCC 4001/028

Compare DCL / BOM Cart
ESCC
Not qualified
ESCC QPL
-55ºC to +140ºC
Surface Mount
Chip
4723 (11958 Metric)
3W
R018
50ppm/ºC
±1%

400102702R033D
SMS-PW R033 ±0,5% ±50ppm/ºC Chip 2512
Isabellenhuette
ESCC 4001/027

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +170ºC
Surface Mount
Chip
2512 (6432 Metric)
2W
R033
50ppm/ºc
±0,5%
Part validation activities
Cost & Activity Matrix
  • <
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • >
Alter Technology Laboratory Services
  • Screening
  • Evaluation/Qualification
  • Scanning Acoustic Microscopy
  • RF/Microwave
  • Incoming Inspection
  • DPA

EEE Components
  • Capacitors
  • Microcircuits
  • Resistors
  • Crystals and Oscillators
  • Schottky Barrier Rectifiers
  • Discretes

Laboratory Success Cases
  • GRACE Project
  • XRAY, SAM and Cross Section
  • SiC schottky Diode
  • JUICE Case
  • Deimos Neptuno
  • Melissa III

Company
  • About Us
  • Contact-us
  • How does doEEEt works?
Security & Privacity
  • Privacy Policy and Legal Notice
  • Copyright
  • Contact Clause
  • LinkedIn LinkedIn
  • Twitter Twitter
Copyright © 2025 ALTER TECHNOLOGY TÜV NORD S.A.U
All rights reserved.