


Cross Sectioning for MRAM Memory
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for MRAM Memory
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
163 results found for MRAM/RAM/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CFP-40
TID (HDR): 1000.0
SEL (Let): 111.0
45 ns
16M (2M x 8)
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-40
TID (HDR): 100.0
SEL (Let): 111.0
45 ns
16M (2M x 8)
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CFP-64
TID (HDR): 100.0
SEL (Let): 112.0
SEU (Let): 112.0
50 ns
64M (2M x 8 x 4 / 8M x 8)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-40
TID (HDR): 500.0
SEL (Let): 111.0
45 ns
16M(2M x 8)
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-40
TID (HDR): 300.0
SEL (Let): 111.0
45 ns
16M (2M x 8)
QML Q+
Qualified
QPDSIS-38535
Surface Mount
CFP-40
TID (HDR): 500.0
SEL (Let): 111.0
45 ns
16M(2M x 8)
QML V
Not qualified
QPDSIS-38535
Surface Mount
CFP-64
TID (HDR): 100.0
SEL (Let): 112.0
SEU (Let): 112.0
50 ns
64M (2M x 8 x 4 / 8M x 8)
QML Q+
Not qualified
QPDSIS-38535
Surface Mount
CFP-40
TID (HDR): 500.0
SEL (Let): 111.0
45 ns
16M (2M x 8)
QML Q+
Not qualified
QPDSIS-38535
Surface Mount
CFP-64
TID (HDR): 1000.0
SEL (Let): 112.0
SEU (Let): 112.0
50 ns
64M (2M x 8 x 4 / 8M x 8)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-64
TID (HDR): 100.0
SEL (Let): 112.0
SEU (Let): 112.0
50 ns
64M (2M x 8 x 4 / 8M x 8)
Part validation activities
Cost & Activity Matrix