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Bond Pull Test for MRAM Memory
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for MRAM Memory
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
164 results found for MRAM/RAM/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
INDUSTRIAL
Not qualified
NOT LISTED IN QPL
Surface Mount
SOP-54
TID (HDR): 50.0
SEL (Let): 80.0
35ns
64M (8M x 8)
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
SOP-68
TID (HDR): 50.0
SEL (Let): 85.0
SEU (Let): 85.0
35ns
8M (256k x 32)
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
SOP-44
TID (HDR): 50.0
SEL (Let): 85.0
SEU (Let): 85.0
35ns
8M (1M x 8)
INDUSTRIAL
Not qualified
NOT LISTED IN QPL
Surface Mount
SOP-44
TID (HDR): 50.0
SEL (Let): 85.0
SEU (Let): 85.0
35ns
8M (1M x 8)
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-40
TID (HDR): 500.0
SEL (Let): 111.0
45 ns
16M (2M x 8)
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-64
TID (HDR): 300.0
SEL (Let): 112.0
SEU (Let): 112.0
50 ns
64M (2M x 8 x 4 / 8M x 8)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-64
TID (HDR): 500.0
SEL (Let): 112.0
SEU (Let): 112.0
50 ns
64M (2M x 8 x 4 / 8M x 8)
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
SOP-64
TID (HDR): 30.0
SEL (Let): 75.0
SEU (Let): 52.0
250ns
5M (128K x 40)
INDUSTRIAL
Not qualified
NOT LISTED IN QPL
Surface Mount
SOP-64
250ns
8M (256K x 32)
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
SOP-54
TID (HDR): 100.0
SEL (Let): 38.0
SEU (Let): 38.0
35ns
2M (128K x 16)
Part validation activities
Cost & Activity Matrix