Servicio Familia 
Cross Sectioning for MOS Capacitors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for MOS Capacitors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
188 results found for Semiconductor Capacitors/Capacitors
Part reference
Quality level / QPL
Package
Capacitance [Nom]
DC Rated Voltage
Tolerance
Unit price
Lead time
ESCC
Qualified
ESCC QPL
DIE
DIE
39pF
40V
±20%
ESCC
Qualified
ESCC QPL
DIE
DIE
33pF
40V
±20%
ESCC
Qualified
ESCC QPL
DIE
DIE
0,22pF
200V
±10%
ESCC
Qualified
ESCC QPL
DIE
DIE
39pF
100V
±10%
ESCC
Qualified
ESCC QPL
DIE
DIE
82pF
40V
±10%
ESCC
Qualified
ESCC QPL
DIE
DIE
68pF
40V
±20%
ESCC
Qualified
ESCC QPL
DIE
DIE
10pF
200V
±20%
ESCC
Qualified
ESCC QPL
DIE
DIE
100pF
40V
±20%
ESCC
Qualified
ESCC QPL
DIE
DIE
27pF
40V
±10%
ESCC
Qualified
ESCC QPL
DIE
DIE
27pF
100V
±20%
Part validation activities
Cost & Activity Matrix