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Bond Pull Test for Logic Switch ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Logic Switch ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
75 results found for Switch/Logic/Digital/Microcircuits
Part reference
Quality level / QPL
Package
Type
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
JAN B
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
Switch
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CFP-48
Transceiver
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
Switch
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-20
Switch
TID (HDR): 100.0
SEL (Let): 100.0
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-48
Switch
TID (HDR): 100.0
SEL (Let): 100.0
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-48
Switch
TID (HDR): 100.0
SEL (Let): 100.0
ESCC
Not qualified
ESCC QPL
Surface Mount
CSOP-14
Switch
TID (HDR): 100.0
SEL (Let): 119.0
SEU (Let): 119.0
ESCC
Qualified
ESCC QPL
Surface Mount
CFP-14
ESCC
Qualified
ESCC QPL
Through Hole Mount
CDIP-14
Switch
TID (HDR): 100.0
SEL (Let): 119.0
SEU (Let): 119.0
ESCC
Qualified
ESCC QPL
Through Hole Mount
CDIP-14
Switch
TID (HDR): 100.0
SEL (Let): 119.0
SEU (Let): 119.0
Part validation activities
Cost & Activity Matrix