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Bond Pull Test for Logic Register ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Logic Register ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
877 results found for Register/Logic/Digital/Microcircuits
Part reference
Quality level / QPL
Package
3-State Outputs
Type
TID (krads)
SEE (MeV/mg/cm2)
Number of Bits
Number of Channels
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-20
With
Shift Register
8-Bits
1
JAN B
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
Without
Shift Register
8-Bits
1
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
Without
Shift Register
4-Bits
1
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
Without
Storage Register
8-Bits
1
JAN B
Qualified
QPDSIS-38535
Surface Mount
CFP-16
Without
4-by-4 Register File
16-Bits
1
JAN B
Qualified
QPDSIS-38535
Surface Mount
CFP-14
Without
Shift Register
8-Bits
1
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
Without
Shift Register
8-Bits
1
JAN B
Qualified
QPDSIS-38535
Surface Mount
CFP-16
Without
Shift Register
8-Bits
1
QML M
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-20