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Bond Pull Test for Logic Receiver-Transceiver
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Logic Receiver-Transceiver
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1010 results found for Receiver-Transceiver/Logic/Digital/Microcircuits
Part reference
Quality level / QPL
Package
3-State Outputs
Type
TID (krads)
SEE (MeV/mg/cm2)
Number of Bits
Number of Elements
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-48
With
Transceiver
16-Bits
2
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-20
With
Transceiver
8-Bits
1
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-48
With
Transceiver
16-Bits
2
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-20
With
Transceiver
8-Bits
1
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-20
With
Transceiver
8-Bits
1
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-24
With
Transceiver
8-Bits
1
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-24
With
Transceiver
8-Bits
1
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-24
With
Transceiver
8-Bits
1
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-16
Without
Transceiver
4-Bits
1
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-20