


Bond Pull Test for Logic Latch ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Logic Latch ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
759 results found for Latch/Logic/Digital/Microcircuits
Part reference
Quality level / QPL
Package
Type
TID (krads)
SEE (MeV/mg/cm2)
Delay Time [Max]
Number of Bits
Output Type
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-48
D-Type
7,1ns
16-Bits
Non-Inverting
883
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
D-Type
9,5ns
8-Bits
JAN B
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
D-Type
46ns
4-Bits
Inverting,Non-Inverting
JAN B
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
D-Type
27ns
8-Bits
Inverting
JAN B
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
Addressable Latch
46ns
8-Bits
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
D-Type
6,7ns
8-Bits
Non-Inverting
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
D-Type
15ns
8-Bits
Non-Inverting
QML V
Not qualified
QPDSIS-38535
Surface Mount
CFP-20
D-Type
175ns
8-Bits
Non-Inverting
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-20
D-Type
15ns
8-Bits
Non-Inverting
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20