


Cross Sectioning for Logic Gates ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Logic Gates ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
4741 results found for Gates/Logic/Digital/Microcircuits
Part reference
Quality level / QPL
Package
Type
TID (krads)
SEE (MeV/mg/cm2)
Number of Circuits
Number of Inputs
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-14
AND
3
3-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-14
AND
4
2-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SC70-5
Inverter (NOT)
1
1-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TQFP-32
Programmable Delay
2-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-14
Inverter (NOT)
6
1-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
VFSOP-8
NOR
2
2-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8
Translator
2
2-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SC70-5
Inverter (NOT)
1
1-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8