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Bond Pull Test for Logic Gates ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Logic Gates ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
4741 results found for Gates/Logic/Digital/Microcircuits
Part reference
Quality level / QPL
Package
Type
TID (krads)
SEE (MeV/mg/cm2)
Number of Circuits
Number of Inputs
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-14
AND
3
3-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-14
AND
4
2-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SC70-5
Inverter (NOT)
1
1-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TQFP-32
Programmable Delay
2-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-14
Inverter (NOT)
6
1-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
VFSOP-8
NOR
2
2-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8
Translator
2
2-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SC70-5
Inverter (NOT)
1
1-Input
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8