


Cross Sectioning for Logic Decoder ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Logic Decoder ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
260 results found for Decoder/Logic/Digital/Microcircuits
Part reference
Quality level / QPL
Package
Type
TID (krads)
SEE (MeV/mg/cm2)
Configuration
Number of Channels
Unit price
Lead time
JAN B
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
Decoder
2:4
2
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-16
Decoder
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
Decoder
2:4
2
QML M
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
Decoder
2:4
2
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-16
Decoder
2:4
2
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
Decoder
3:8
1
JAN B
Qualified
QPDSIS-38535
Surface Mount
CFP-16
Decoder
2:4
2
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
Decoder
JAN S
Qualified
QPDSIS-38535
Surface Mount
CFP-16