


Cross Sectioning for Logic Comparator ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Logic Comparator ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
276 results found for Comparator/Logic/Digital/Microcircuits
Part reference
Quality level / QPL
Package
Type
TID (krads)
SEE (MeV/mg/cm2)
Number of Bits
Number of Elements
Unit price
Lead time
QML M
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-20
Identity
8-Bits
1
QML M
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
Identity
8-Bits
1
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-28
8-Bits
4
JAN B
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
Magnitude
4-Bits
1
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
Magnitude
4-Bits
1
QML Q
Not qualified
QPDSIS-38535
Through Hole Mount
CDIP-20
Identity
8-Bits
1
QML M
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
Identity
8-Bits
1
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
Magnitude
4-Bits
1
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-20
Magnitude
8-Bits
1
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-20
Magnitude
8-Bits
1
Part validation activities
Cost & Activity Matrix