Servicio Familia 
Bond Pull Test for Linear Regulator
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Linear Regulator
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1584 results found for Linear Regulator/Power Management/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
QFN-16
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TO-263-5
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-14
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
DFN-10
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TO-263-5
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
MSOP-12
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
MSOP-8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TO-263-5
Part validation activities
Cost & Activity Matrix