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Bond Pull Test for LVDS Microcircuits
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for LVDS Microcircuits
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
480 results found for LVDS/Communication-Interface/Microcircuits
Part reference
Quality level / QPL
Package
Type
TID (krads)
SEE (MeV/mg/cm2)
Number of Drivers/Receivers
Number of Receivers
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
LFCSP-12
Comparator
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TQFP-32
2x2 Crosspoint switch
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOT-23-8
Translator
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-56
SER/DES
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-16
Repeater
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-38
Driver
8/8
8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-16
Driver
4/4
4
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-16
Driver
4/4
4
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-18