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Bond Pull Test for LED
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for LED
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
266 results found for LED/Diode/Discretes
Part reference
Quality level / QPL
Package
TID (krads)
Colour
Forward Voltage [Max]
Luminous Intensity [Min]
Peak Radiometric Wavelength Range
Unit price
Lead time
JANTX
Not qualified
QPDSIS-19500
Through Hole Mount
DIL-8
Red
7V
190ucd
Not Available
JANTX
Qualified
QPDSIS-19500
Through Hole Mount
See Spec
Red
30V
500ucd
595nm to 695nm
JANTX
Not qualified
QPDSIS-19500
Through Hole Mount
DIL-8
Red
7V
79ucd
Not Available
JANTX
Qualified
QPDSIS-19500
Through Hole Mount
See Spec
Green
30V
400ucd
525nm to 580nm
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
DIL-8
Red
7V
106ucd
Not Available
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
DIL-8
Red
7V
44ucd
Not Available
JANTX
Not qualified
QPDSIS-19500
Through Hole Mount
DIL-8
Red
7V
44ucd
Not Available
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
DIL-8
Red
7V
257ucd
Not Available
JAN
Qualified
QPDSIS-19500
Through Hole Mount
See Spec