


Bond Pull Test for LED
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for LED
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
266 results found for LED/Diode/Discretes
Part reference
Quality level / QPL
Package
TID (krads)
Colour
Forward Voltage [Max]
Luminous Intensity [Min]
Peak Radiometric Wavelength Range
Unit price
Lead time
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
DIL-8
Red
7V
106ucd
Not Available
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
DIL-8
Red
7V
457ucd
Not Available
JANTX
Not qualified
QPDSIS-19500
Through Hole Mount
DIL-8
Red
7V
257ucd
Not Available
JANTX
Not qualified
QPDSIS-19500
Through Hole Mount
DIL-8
Red
7V
190ucd
Not Available
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
DIL-8
Red
7V
59ucd
Not Available
JANTX
Qualified
QPDSIS-19500
Through Hole Mount
See Spec
Yellow
3V
1mcd
570nm to 595nm
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
DIL-8
Red
7V
343ucd
Not Available
JAN
Qualified
QPDSIS-19500
Through Hole Mount
See Spec
Red
30V
500ucd
595nm to 695nm
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
DIL-8