


Cross Sectioning for Image Sensor
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Image Sensor
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
2 results found for Image Sensor/IC Sensors/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
CQCC-84 (J-Lead)
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CQCC-84 (J-Lead)
Part validation activities
Cost & Activity Matrix