


Bond Pull Test for Hybrid Relays
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Hybrid Relays
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
656 results found for Hybrid/Relays
Part reference
Quality level / QPL
Package
Contact Configuration
Rated Coil Resistance
Rated Coil Voltage
Unit price
Lead time
FAILURE RATE L
Qualified
QPDSIS-28776
Through Hole Mount
TO-5
SPDT
4K0
26.5V
FAILURE RATE M
Qualified
QPDSIS-28776
Through Hole Mount
TO-5
DPDT
50R
5V
FAILURE RATE L
Qualified
QPDSIS-28776
Through Hole Mount
TO-5
DPDT
6K5
36V
FAILURE RATE L
Qualified
QPDSIS-28776
Through Hole Mount
TO-5
SPDT
4K0
26.5V
FAILURE RATE L
Qualified
QPDSIS-28776
Through Hole Mount
TO-5
SPDT
2K0
26.5V
FAILURE RATE M
Qualified
QPDSIS-28776
Through Hole Mount
TO-5
SPDT
125R
6V
FAILURE RATE L
Qualified
QPDSIS-28776
Through Hole Mount
TO-5
SPDT
2K3
18V
FAILURE RATE M
Qualified
QPDSIS-28776
Through Hole Mount
TO-5 (With Spreader Pad)
SPDT
255R
6V
FAILURE RATE L
Qualified
QPDSIS-28776
Through Hole Mount
TO-5 (With Spreader Pad)
SPDT
630R
9V
FAILURE RATE L
Qualified
QPDSIS-28776
Through Hole Mount
TO-5
SPDT
255R
6V
Part validation activities
Cost & Activity Matrix