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doEEEt Bond Pull Test for Hybrid Relays | doEEEt.com
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Bond Pull Test for Hybrid Relays

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

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EEE Parts Results Page

Bond Pull Test for Hybrid Relays

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

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  • Relays
    • Hybrid

656 results found for Hybrid/Relays

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Part reference
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Package
Contact Configuration
Rated Coil Resistance
Rated Coil Voltage
Unit price
Lead time

M28776/4-030L
M28776/4 1PDT 26.5V TO-5
Teledyne Relays
MIL-PRF-28776/4

Compare DCL / BOM Cart
FAILURE RATE L
Qualified
QPDSIS-28776
-65ºC to +125ºC
Through Hole Mount
TO-5
SPDT
4K0
26.5V

M28776/1-019M
M28776/1 2PDT 5V TO-5
Teledyne Relays
MIL-PRF-28776/1

Compare DCL / BOM Cart
FAILURE RATE M
Qualified
QPDSIS-28776
-65ºC to +125ºC
Through Hole Mount
TO-5
DPDT
50R
5V

M28776/3-031L
M28776/3 2PDT 36V TO-5
TE Connectivity -CII Technologies-
MIL-PRF-28776/3

Compare DCL / BOM Cart
FAILURE RATE L
Qualified
QPDSIS-28776
-65ºC to +125ºC
Through Hole Mount
TO-5
DPDT
6K5
36V

M28776/4-022L
M28776/4 1PDT 26.5V TO-5
TE Connectivity -CII Technologies-
MIL-PRF-28776/4

Compare DCL / BOM Cart
FAILURE RATE L
Qualified
QPDSIS-28776
-65ºC to +125ºC
Through Hole Mount
TO-5
SPDT
4K0
26.5V

M28776/5-018L
M28776/5 1PDT 26.5V TO-5
TE Connectivity -CII Technologies-
MIL-PRF-28776/5

Compare DCL / BOM Cart
FAILURE RATE L
Qualified
QPDSIS-28776
-65ºC to +125ºC
Through Hole Mount
TO-5
SPDT
2K0
26.5V

M28776/5-020M
M28776/5 1PDT 6V TO-5
Teledyne Relays
MIL-PRF-28776/5

Compare DCL / BOM Cart
FAILURE RATE M
Qualified
QPDSIS-28776
-65ºC to +125ºC
Through Hole Mount
TO-5
SPDT
125R
6V

M28776/4-029L
M28776/4 1PDT 18V TO-5
TE Connectivity -CII Technologies-
MIL-PRF-28776/4

Compare DCL / BOM Cart
FAILURE RATE L
Qualified
QPDSIS-28776
-65ºC to +125ºC
Through Hole Mount
TO-5
SPDT
2K3
18V

M28776/4-042M
M28776/4 1PDT 6V TO-5 (Spreader Pad)
Teledyne Relays
MIL-PRF-28776/4

Compare DCL / BOM Cart
FAILURE RATE M
Qualified
QPDSIS-28776
-65ºC to +125ºC
Through Hole Mount
TO-5 (With Spreader Pad)
SPDT
255R
6V

M28776/4-043L
M28776/4 1PDT 9V TO-5 (Spreader Pad)
Teledyne Relays
MIL-PRF-28776/4

Compare DCL / BOM Cart
FAILURE RATE L
Qualified
QPDSIS-28776
-65ºC to +125ºC
Through Hole Mount
TO-5 (With Spreader Pad)
SPDT
630R
9V

M28776/4-034L
M28776/4 1PDT 6V TO-5
Teledyne Relays
MIL-PRF-28776/4

Compare DCL / BOM Cart
FAILURE RATE L
Qualified
QPDSIS-28776
-65ºC to +125ºC
Through Hole Mount
TO-5
SPDT
255R
6V
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