Servicio Familia 
Bond Pull Test for Hall Effect Sensors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Hall Effect Sensors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
33 results found for Hall Effect/IC Sensors/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
JAN S EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
CLASS S EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
CLASS S EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Similar TO-92
Part validation activities
Cost & Activity Matrix