


Cross Sectioning for HEMT RF Transistors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for HEMT RF Transistors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
23 results found for HEMT RF/FET RF/RF-Microwave Transistor/Transistor/Discretes
Part reference
Quality level / QPL
Package
Unit price
Lead time
ESCC
Not qualified
ESCC QPL
Surface Mount
MICRO-X
ESCC
Not qualified
ESCC QPL
Surface Mount
MICRO-X
ESCC
Not qualified
ESCC QPL
Surface Mount
MWP25
ESCC
Not qualified
ESCC QPL
Surface Mount
MICRO-X
ESCC
Not qualified
ESCC QPL
Surface Mount
MWP25
ESCC
Not qualified
ESCC QPL
Surface Mount
MICRO-X
ESCC C
Not qualified
ESCC QPL
Surface Mount
MICRO-X
ESCC
Not qualified
ESCC QPL
Surface Mount
MICRO-X
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
Surface Mount
ME
ESCC C
Not qualified
ESCC QPL
Surface Mount
MICRO-X
Part validation activities
Cost & Activity Matrix