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doEEEt Cross Sectioning for Flash Memory | doEEEt.com
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Cross Sectioning for Flash Memory

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

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EEE Parts Results Page

Cross Sectioning for Flash Memory

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

Applications expected requirements
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  • Microcircuits
    • Digital
      • Memory
        • ROM
          • Flash

654 results found for Flash/ROM/Memory/Digital/Microcircuits

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Part reference
Quality level / QPL
TOP
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time

MT29F128G08AJAAAWP-ITZ:A
MT29F128G08AJAAAWP-ITZ:A
Micron Technology
MFR DS MT29F

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
TSOP-48
128G (16G x 8)

5962-9471605HMC
AS8F128K32Q-60/Q
Micross Components
5962-94716

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CQFP-68 (Gull Wing)
60 ns
4M (128K x 32)

5962-9669004HTC
WMF128K8-70FEQ5
Mercury Systems Inc
5962-96690

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CFP-32
70 ns
1M (128K x 8)

5962-9669003HYC
WMF128K8-90CQ5
Mercury Systems Inc
5962-96690

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-32
90 ns
1M (128K x 8)

5962-9669002HUA
AS29F010DCG-120/Q
Micross Components
5962-96690

Compare DCL / BOM Cart
QML H
Not qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CFP-32
120 ns
1M (128K x 8)

5962-9471604HAA
WF128K32-70G2LQ5
Mercury Systems Inc
5962-94716

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CQFP-68 (Gull Wing)
70 ns
4M (128K x 32)

5962-9471604HYC
WF128K32N-70HQ5
Mercury Systems Inc
5962-94716

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
HIP-66 (With Standoffs)
70 ns
4M (128K x 32)

5962-9669005HTC
WMF128K8-60FEQ5
Mercury Systems Inc
5962-96690

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CFP-32
60 ns
1M (128K x 8)

5962-9471602HMA
WF128K32-120G2Q5
Mercury Systems Inc
5962-94716

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CQFP-68 (Gull Wing)
120 ns
4M (128K x 32)

5962-9461201HAC
AS8F512K32Q1-150/883
Micross Components
5962-94612

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CQFP-68 (Gull Wing)
150 ns
16M (512K x 32)
Part validation activities
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