Servicio Familia 
Bond Pull Test for Flash Memory
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Flash Memory
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
654 results found for Flash/ROM/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSOP-48
128G (16G x 8)
QML H
Qualified
QPDSIS-38534
Surface Mount
CFP-32
60 ns
1M (128K x 8)
QML H
Qualified
QPDSIS-38534
Surface Mount
CQFP-68 (Gull Wing)
120 ns
4M (128K x 32)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
HIP-66 (With Standoffs)
90 ns
16M (512K x 32)
QML H
Qualified
QPDSIS-38534
Surface Mount
CQFP-68
90 ns
16M (512K x 32)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
HIP-66 (With Standoffs)
150 ns
4M (128K x 32)
QML H
Qualified
QPDSIS-38534
Surface Mount
CQFP-68 (Gull Wing)
150 ns
16M (512K x 32)
QML H
Qualified
QPDSIS-38534
Surface Mount
CQFP-68 (Gull Wing)
60 ns
4M (128K x 32)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
HIP-66 (With Standoffs)
120 ns
4M (128K x 32)
QML H
Qualified
QPDSIS-38534
Surface Mount
CQFP-68
150 ns
4M (128K x 32)
Part validation activities
Cost & Activity Matrix