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doEEEt Cross Sectioning for Film Resistors | doEEEt.com
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Cross Sectioning for Film Resistors

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

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EEE Parts Results Page

Cross Sectioning for Film Resistors

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

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17121749 results found for Film/Resistors

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Package
Power Rating
Resistance [Nom]
Temperature Coefficient of Resistance
Tolerance
Unit price
Lead time

M55342M04T105ES
RM1505 105K 1% 300ppm/ºC Chip
Mini Systems
MIL-PRF-55342/4

Compare DCL / BOM Cart
FAILURE RATE S
Qualified
QPDSIS-55342
Surface Mount
Chip
1505 (3812 Metric)
150mW
105K
±300ppm/ºC
±1%

M55342K09C330JV
RM2512 330R 5% 100ppm/ºC Chip
State of the art
MIL-PRF-55342/9

Compare DCL / BOM Cart
LEVEL V
Qualified
QPDSIS-55342
Surface Mount
Chip
2512 (6432 Metric)
1W
330R
±100ppm/ºC
±5%

M55342E01W931AU
RM0502 931R 0,1% 25ppm/ºC Chip
State of the art
MIL-PRF-55342/1

Compare DCL / BOM Cart
LEVEL U
Qualified
QPDSIS-55342
Surface Mount
Chip
0502 (1406 Metric)
50mW
931R
±25ppm/ºC
±0,1%

M55342K05C517YU
RM2208 517K 0,5% 100ppm/ºC Chip
Mini Systems
MIL-PRF-55342/5

Compare DCL / BOM Cart
LEVEL U
Qualified
QPDSIS-55342
Surface Mount
Chip
2208 (5720 Metric)
225mW
517K
±100ppm/ºC
±0,5%

M55342M09C1E30C
RM2512 1K30 1% 300ppm/ºc Chip
State of the art
MIL-PRF-55342/9

Compare DCL / BOM Cart
NON-ER
Qualified
QPDSIS-55342
Surface Mount
Chip
2512 (6432 Metric)
1W
1K30
±300ppm/ºC
±1%

M55342K02C47N0V
RM0505 47K0 10% 100ppm/ºC Chip
State of the art
MIL-PRF-55342/2

Compare DCL / BOM Cart
LEVEL V
Qualified
QPDSIS-55342
Surface Mount
Chip
0505 (1412 Metric)
125mW
47K0
±100ppm/ºC
±10%

M55342H03B160KT
RM1005 160K 5% 50ppm/ºC Chip
State of the art
MIL-PRF-55342/3

Compare DCL / BOM Cart
LEVEL T
Qualified
QPDSIS-55342
Surface Mount
Chip
1005 (2512 Metric)
200mW
160K
50ppm/ºC
±5%

M55342L05G673WT
RM2208 673R 0,5% 200ppm/ºC Chip
Mini Systems
MIL-PRF-55342/5

Compare DCL / BOM Cart
LEVEL T
Qualified
QPDSIS-55342
Surface Mount
Chip
2208 (5720 Metric)
225mW
673R
±200ppm/ºC
±0,5%

M55342K01T12U4P
RM0502 12K4 0,25% 100ppm/ºC Chip
Mini Systems
MIL-PRF-55342/1

Compare DCL / BOM Cart
FAILURE RATE P
Qualified
QPDSIS-55342
Surface Mount
Chip
0502 (1406 Metric)
50mW
12K4
±100ppm/ºC
±0,25%

M55342L06B18F2C
RM0705 18M2 1% 200ppm/ºC Chip
Mini Systems
MIL-PRF-55342/6

Compare DCL / BOM Cart
NON-ER
Qualified
QPDSIS-55342
Surface Mount
Chip
0705 (1712 Metric)
150mW
18M2
±200ppm/ºC
±1%
Part validation activities
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