


Bond Pull Test for Film Resistors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Film Resistors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
17121749 results found for Film/Resistors
Part reference
Quality level / QPL
Package
Power Rating
Resistance [Nom]
Temperature Coefficient of Resistance
Tolerance
Unit price
Lead time
FAILURE RATE R
Qualified
ESCC QPL
Surface Mount
Chip
0603 (1608 Metric)
100mW
18R6
±200ppm/ºC
±5%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
2512 (6432 Metric)
800mW
43K2
±200ppm/ºC
±5%
FAILURE RATE R
Qualified
ESCC QPL
Surface Mount
Chip
0603 (1608 Metric)
100mW
88R3
±200ppm/ºC
±5%
FAILURE RATE R
Qualified
ESCC QPL
Surface Mount
Chip
2010 (5025 Metric)
500mW
855K
±200ppm/ºC
±2%
FAILURE RATE R
Qualified
ESCC QPL
Surface Mount
Chip
2010 (5025 Metric)
500mW
629K
±100ppm/ºC
±5%
FAILURE RATE R
Qualified
ESCC QPL
Surface Mount
Chip
2010 (5025 Metric)
500mW
90K2
±200ppm/ºC
±2%
FAILURE RATE R
Qualified
ESCC QPL
Surface Mount
Chip
2010 (5025 Metric)
500mW
19K0
±200ppm/ºC
±5%
ESCC
Qualified
ESCC QPL
Surface Mount
Chip
1206 (3216 Metric)
250mW
47K3
±100ppm/ºC
±1%
FAILURE RATE R
Qualified
ESCC QPL
Surface Mount
Chip
0603 (1608 Metric)
100mW
58R4
±200ppm/ºC
±5%
FAILURE RATE R
Qualified
ESCC QPL
Surface Mount
Chip
2512 (6432 Metric)