


Bond Pull Test for Film Resistors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Film Resistors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
17121749 results found for Film/Resistors
Part reference
Quality level / QPL
Package
Power Rating
Resistance [Nom]
Temperature Coefficient of Resistance
Tolerance
Unit price
Lead time
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
500mW
78K7
±25ppm/ºC
±0,5%
ESCC C
Not qualified
ESCC QPL
Surface Mount
Chip
1206 (3216 Metric)
250mW
23R7
±100ppm/ºC
±2%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
100mW
1K40
50ppm/ºC
±0,5%
ESCC C
Not qualified
ESCC QPL
Surface Mount
Chip
0505 (1412 Metric)
125mW
6R34
±200ppm/ºC
±1%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
100mW
3R57
±10ppm/ºC
±0,5%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
100mW
10K7
±25ppm/ºC
±1%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
250mW
301R
±25ppm/ºC
±1%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
500mW
15K4
50ppm/ºC
±0,5%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Axial
-
100mW
1R13
±10ppm/ºC
±1%
ESCC C
Not qualified
ESCC QPL
Through Hole Mount
Axial
-