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doEEEt Bond Pull Test for Film Resistors | doEEEt.com
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Bond Pull Test for Film Resistors

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

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EEE Parts Results Page

Bond Pull Test for Film Resistors

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

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  • Resistors
    • Film

17121749 results found for Film/Resistors

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Package
Power Rating
Resistance [Nom]
Temperature Coefficient of Resistance
Tolerance
Unit price
Lead time

400102611R18R6J6
CHPFR 0603 18R6 5% 200ppm/ºC 50V 100mW
Vishay Sfernice
ESCC 4001/026

Compare DCL / BOM Cart
FAILURE RATE R
Qualified
ESCC QPL
-55ºC to +155ºC
Surface Mount
Chip
0603 (1608 Metric)
100mW
18R6
±200ppm/ºC
±5%

4001026104322J6
CHPHR 2512 43K2 5% 200ppm/ºC 300V 800mW
Vishay Sfernice
ESCC 4001/026

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +155ºC
Surface Mount
Chip
2512 (6432 Metric)
800mW
43K2
±200ppm/ºC
±5%

400102616R88R3J6
CHPFR 0603 88R3 5% 200ppm/ºC 50V 100mW
Vishay Sfernice
ESCC 4001/026

Compare DCL / BOM Cart
FAILURE RATE R
Qualified
ESCC QPL
-55ºC to +155ºC
Surface Mount
Chip
0603 (1608 Metric)
100mW
88R3
±200ppm/ºC
±5%

400102614R8553G6
CHPFR 2010 855K 2% 200ppm/ºC 300V 500mW
Vishay Sfernice
ESCC 4001/026

Compare DCL / BOM Cart
FAILURE RATE R
Qualified
ESCC QPL
-55ºC to +155ºC
Surface Mount
Chip
2010 (5025 Metric)
500mW
855K
±200ppm/ºC
±2%

400102619R6293J4
CHPFR 2010 629K 5% 100ppm/ºc 300V 500mW
Vishay Sfernice
ESCC 4001/026

Compare DCL / BOM Cart
FAILURE RATE R
Qualified
ESCC QPL
-55ºC to +155ºC
Surface Mount
Chip
2010 (5025 Metric)
500mW
629K
±100ppm/ºC
±5%

400102619R9022G6
CHPFR 2010 90K2 2% 200ppm/ºC 300V 500mW
Vishay Sfernice
ESCC 4001/026

Compare DCL / BOM Cart
FAILURE RATE R
Qualified
ESCC QPL
-55ºC to +155ºC
Surface Mount
Chip
2010 (5025 Metric)
500mW
90K2
±200ppm/ºC
±2%

400102619R1902J6
CHPFR 2010 19K0 5% 200ppm/ºC 300V 500mW
Vishay Sfernice
ESCC 4001/026

Compare DCL / BOM Cart
FAILURE RATE R
Qualified
ESCC QPL
-55ºC to +155ºC
Surface Mount
Chip
2010 (5025 Metric)
500mW
19K0
±200ppm/ºC
±5%

4001026084732F4
CHPHR 1206 47K3 1% 100ppm/ºc 200V 250mW
Vishay Sfernice
ESCC 4001/026

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +155ºC
Surface Mount
Chip
1206 (3216 Metric)
250mW
47K3
±100ppm/ºC
±1%

400102616R58R4J6
CHPFR 0603 58R4 5% 200ppm/ºC 50V 100mW
Vishay Sfernice
ESCC 4001/026

Compare DCL / BOM Cart
FAILURE RATE R
Qualified
ESCC QPL
-55ºC to +155ºC
Surface Mount
Chip
0603 (1608 Metric)
100mW
58R4
±200ppm/ºC
±5%

400102620R8830F4
CHPFR 2512 883R 1% 100ppm/ºc 300V 800mW
Vishay Sfernice
ESCC 4001/026

Compare DCL / BOM Cart
FAILURE RATE R
Qualified
ESCC QPL
-55ºC to +155ºC
Surface Mount
Chip
2512 (6432 Metric)
800mW
883R
±100ppm/ºC
±1%
Part validation activities
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