


Bond Pull Test for Film Capacitors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Film Capacitors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
98139 results found for Film Capacitors/Capacitors
Part reference
Quality level / QPL
Package
Capacitance [Nom]
DC Rated Voltage
Tolerance
Unit price
Lead time
FAILURE RATE M
Qualified
QPDSIS-83421
Through Hole Mount
Axial
180nF
200V
±10%
FAILURE RATE R
Not qualified
QPDSIS-83421
Through Hole Mount
Axial
15nF
30V
±2%
FAILURE RATE P
Qualified
QPDSIS-83421
Through Hole Mount
Axial
5nF
200V
±10%
FAILURE RATE R
Qualified
QPDSIS-83421
Through Hole Mount
Axial
50nF
400V
±0,25%
FAILURE RATE M
Qualified
QPDSIS-83421
Through Hole Mount
Axial
680nF
100V
±2%
FAILURE RATE M
Qualified
QPDSIS-83421
Through Hole Mount
Axial
10nF
400V
±10%
FAILURE RATE P
Not qualified
QPDSIS-83421
Through Hole Mount
Axial
2,7nF
200V
±0,5%
FAILURE RATE R
Qualified
QPDSIS-83421
Through Hole Mount
Axial
56nF
400V
±0,5%
FAILURE RATE R
Qualified
QPDSIS-83421
Through Hole Mount
Axial
2uF
50V
±0,5%
FAILURE RATE S
Qualified
QPDSIS-83421
Through Hole Mount
Axial
56nF
30V
±0,25%
Part validation activities
Cost & Activity Matrix