Servicio Familia 
Bond Pull Test for Film Capacitors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Film Capacitors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
98139 results found for Film Capacitors/Capacitors
Part reference
Quality level / QPL
Package
Capacitance [Nom]
DC Rated Voltage
Tolerance
Unit price
Lead time
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
39,2nF
50V
±1%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
301nF
50V
±2%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
187nF
100V
±1%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
5,6nF
100V
±5%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
11,5nF
100V
±2%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
40,2nF
50V
±2%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
619nF
50V
±1%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
5,23nF
100V
±1%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
249nF
100V
±2%
ESCC B
Not qualified
ESCC QPL
Surface Mount
Chip
2,4nF
100V
±5%
Part validation activities
Cost & Activity Matrix