


Bond Pull Test for Ferrite Beads
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Ferrite Beads
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
672 results found for Ferrite Beads/Filters
Part reference
Quality level / QPL
Package
DC Resistance [Max]
Impedance [Nom]
Rated Current
Tolerance
Unit price
Lead time
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0805 (2012 Metric)
20mOhms
30Ohms
4A
±10%
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0603 (1608 Metric)
150mOhms
30Ohms
500mA
±20%
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
1206 (3216 Metric)
300mOhms
600Ohms
1A
±25%
MILITARY STD.
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0603 (1608 Metric)
200mOhms
100Ohms
400mA
±20%
CLASS S EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0603 (1608 Metric)
400mOhms
600Ohms
200mA
±5%
CLASS S EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0603 (1608 Metric)
400mOhms
600Ohms
200mA
±20%
MILITARY STD.
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0603 (1608 Metric)
150mOhms
60Ohms
500mA
±25%
CLASS S EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0603 (1608 Metric)
150mOhms
60Ohms
500mA
±20%
MILITARY STD.
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0603 (1608 Metric)