


Bond Pull Test for Ferrite Beads
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Ferrite Beads
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
672 results found for Ferrite Beads/Filters
Part reference
Quality level / QPL
Package
DC Resistance [Max]
Impedance [Nom]
Rated Current
Tolerance
Unit price
Lead time
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
1206 (3216 Metric)
10mOhms
30Ohms
4A
±20%
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
1206 (3216 Metric)
200mOhms
500Ohms
1A
±10%
CLASS S EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0603 (1608 Metric)
350mOhms
400Ohms
200mA
±25%
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0805 (2012 Metric)
250mOhms
470Ohms
1A
±25%
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0603 (1608 Metric)
250mOhms
180Ohms
400mA
±5%
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0805 (2012 Metric)
20mOhms
30Ohms
4A
±20%
MILITARY STD.
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0805 (2012 Metric)
80mOhms
50Ohms
2A
±10%
CLASS S EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0603 (1608 Metric)
250mOhms
150Ohms
400mA
±20%
CLASS B EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
Chip
0805 (2012 Metric)