Skip to Content
  • Resources
    • COTS For Space WEBINARS
    • EEE Components
    • SPECIFICATIONS / QPLs
    • Events / Webinars
    • Space Talks
    • Tech Articles
    • Manufacturer Notifications
  • Laboratory Services
    • Laboratory Standard Testing
    • Non Standard Testing
    • Silicon Carbide -SiC- Diodes
    • CrowdTesting
    • Optoelectronics
    • Small Sats
    • Representative Projects / Papers
  • Additional Services
    • Industry 4.0 Cybersecurity (IEC 62443) NEW
    • Penetration Test NEW
    • Cybersecurity Certified (CSC) NEW
    • Code Score Matrix NEW
    • Long-term storage of wafers
    • Electronic Design
  • Tools
    • Comparator
    • MYDCLs / BOMs
    • esa-stockplace
  • About Us
  • Proposal Next
  • Sign In
Cookies on the doEEEt website. We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies on the doEEEt website. However, if you would like to, you can change your cookie settings at any time. Link to cookies policy.
doEEEt Bond Pull Test for Fast Recovery Rectifier | doEEEt.com
  • Home
  • How does doEEEt works
  • About us
  • Contact Us
  • Terms of Use
  • Disclaimer
  • Privacy Policy
  • Privacy Policy and Legal Notice
  • Cookie Policy
  • Copyright
  • autosignup2
  • Instant Quote
  • Introducing NanoXplore And Its European FPGA’s ITAR Free
  • Space Talks 3 - Dan Friedlander
  • autosignup3
  • Shopping Cart
  • wpo
  • Data Protection
  • Components
  • Documents
Please enter at least one character to search
ALTER Laboratory Services
Servicio Familia Servicio Familia
Image
Image

Bond Pull Test for Fast Recovery Rectifier

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

Fill the form to receive expert assistance from our skilled engineers and technicians

Read Policy

Related content

X-Ray Inspection applied to DPA test

Non-destructive internal inspection of EEE parts and passive components

electrical testing

Alter Technology SAM Additional Testing Capabilities

procurement-EEE-Parts

Reasons to do an Element Evaluation Procedure of EEE Parts

EEE Parts Results Page

Bond Pull Test for Fast Recovery Rectifier

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

Applications expected requirements
Category
Category
Recommended
More...
Close
  • Discretes
    • Diode
      • Rectifier
        • Fast Recovery

7550 results found for Fast Recovery/Rectifier/Diode/Discretes

Reset
Part reference
Quality level / QPL
TOP
Package
TID (krads)
Average Output Rectified Current [Max]
Forward Surge Current [Max]
Forward Voltage [Max]
Time for Reverse Recovery [Max]
Working Peak Reverse Voltage [Max]
Unit price
Lead time

JAN1N3890AR
1N3890AR DO-203AA (DO-4)
Microsemi a Microchip Company
MIL-PRF-19500/304

Compare DCL / BOM Cart
JAN
Qualified
QPDSIS-19500
-65ºC to +150ºC
Point to Point Wiring
DO-203AA (DO-4)
20A
250A
2,75V
150ns
100V

SDR510
SDR510 DO-203AB (DO-5)
Solid State Devices Inc
MFR DS RU0049

Compare DCL / BOM Cart
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
-65ºC to +175ºC
Point to Point Wiring
DO-203AB (DO-5)
50A
625A
1,7V
80ns
1000V

JANTX1N5811US
1N5811US Melf A (US)
VPT Components
MIL-PRF-19500/477

Compare DCL / BOM Cart
JANTX
Not qualified
QPDSIS-19500
-65ºC to +125ºC
Surface Mount
Melf A (US)
3A
150A
0,925V
30ns
150V

JAN1N6631U
1N6631U Melf E (US)
Sensitron
MIL-PRF-19500/590

Compare DCL / BOM Cart
JAN
Qualified
QPDSIS-19500
-65ºC to +150ºC
Surface Mount
Melf E (US)
1,4A
60A
1,95V
60ns
1000V

SER30KE40
SER30KE40 Sedpack 2 (KE)
Solid State Devices Inc
MFR DS RC0128

Compare DCL / BOM Cart
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
-55ºC to +200ºC
Surface Mount
Sedpack 2 (KE)
30A
400A
1,4V
35ns
400V

SDR305
SDR305 DO-203AB (DO-5)
Solid State Devices Inc
MFR DS RU0023

Compare DCL / BOM Cart
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
-65ºC to +175ºC
Point to Point Wiring
DO-203AB (DO-5)
30A
275A
900mV
50ns
50V

1N3879
1N3879 DO-203AA (DO-4)
Solid State Devices Inc
MFR DS RF0003

Compare DCL / BOM Cart
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
-65ºC to +150ºC
Point to Point Wiring
DO-203AA (DO-4)
6A
150A
1,1V
120ns
50V

JANS1N5809US
1N5809US Melf A (US)
VPT Components
MIL-PRF-19500/477

Compare DCL / BOM Cart
JANS
Not qualified
QPDSIS-19500
-65ºC to +125ºC
Surface Mount
Melf A (US)
3A
150A
0,925V
30ns
100V

SDR808
SDR808 DO-203AB (DO-5)
Solid State Devices Inc
MFR DS RU0059

Compare DCL / BOM Cart
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
-55ºC to +175ºC
Point to Point Wiring
DO-203AB (DO-5)
100A
800A
1,5V
60ns
300V

SDR905
SDR905 DO-203AB (DO-5)
Solid State Devices Inc
MFR DS RU0025

Compare DCL / BOM Cart
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
-65ºC to +175ºC
Point to Point Wiring
DO-203AB (DO-5)
30A
350A
1,45V
50ns
500V
Part validation activities
Cost & Activity Matrix
  • <
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • >
Alter Technology Laboratory Services
  • Screening
  • Evaluation/Qualification
  • Scanning Acoustic Microscopy
  • RF/Microwave
  • Incoming Inspection
  • DPA

EEE Components
  • Capacitors
  • Microcircuits
  • Resistors
  • Crystals and Oscillators
  • Schottky Barrier Rectifiers
  • Discretes

Laboratory Success Cases
  • GRACE Project
  • XRAY, SAM and Cross Section
  • SiC schottky Diode
  • JUICE Case
  • Deimos Neptuno
  • Melissa III

Company
  • About Us
  • Contact-us
  • How does doEEEt works?
Security & Privacity
  • Privacy Policy and Legal Notice
  • Copyright
  • Contact Clause
  • LinkedIn LinkedIn
  • Twitter Twitter
Copyright © 2025 ALTER TECHNOLOGY TÜV NORD S.A.U
All rights reserved.