


Cross Sectioning for FIFO Memory
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for FIFO Memory
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
459 results found for FIFO/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
15 ns
288K (32K x 9)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
20 ns
18K (2K x 9)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
20 ns
288K (32K x 9)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
20 ns
36K (4K x 9)
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
LQFP-80
133 ns
288K (16K x 18 / 32K x 9)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
50 ns
72K (8K x 9)
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CQLCC-32
20 ns
18K (2K x 9)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-28
65 ns
18K (2K x 9)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
20 ns
18K (2K x 9)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
65 ns
9K (1K x 9)
Part validation activities
Cost & Activity Matrix