


Cross Sectioning for FIFO Memory
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for FIFO Memory
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
459 results found for FIFO/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
30 ns
36K (4K x 9)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
30 ns
4,5K (512 x 9)
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-28
15 ns
36K (4K x 9)
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-28
15 ns
144K (16K x 9)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
50 ns
36K (4K x 9)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
30 ns
72K (8K x 9)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-28
40 ns
36K (4K x 9)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-28
40 ns
4,5K (512 x 9)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
25 ns
4,5K (512 x 9)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
20 ns
288K (32K x 9)
Part validation activities
Cost & Activity Matrix