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doEEEt Bond Pull Test for FIFO Memory | doEEEt.com
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Bond Pull Test for FIFO Memory

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

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EEE Parts Results Page

Bond Pull Test for FIFO Memory

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

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  • Microcircuits
    • Digital
      • Memory
        • FIFO

459 results found for FIFO/Memory/Digital/Microcircuits

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Part reference
Quality level / QPL
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Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time

5962-9315207QYA
CY7C464A-15LMB
Teledyne e2v Inc
5962-93152

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-32
15 ns
288K (32K x 9)

5962-8866906YA
CY7C429-20DMB
Teledyne e2v Inc
5962-88669

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
20 ns
18K (2K x 9)

5962-9315206QYA
CY7C464A-20LMB
Teledyne e2v Inc
5962-93152

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-32
20 ns
288K (32K x 9)

5962-9071507MZA
CY7C433-20LMB
Teledyne e2v Inc
5962-90715

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-32
20 ns
36K (4K x 9)

V62/03639-02XE
SN74V273PZAEP
Texas Instruments
V62/03639

Compare DCL / BOM Cart
EP
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
LQFP-80
133 ns
288K (16K x 18 / 32K x 9)

5962-9167702MXA
CY7C460A-50DMB
Teledyne e2v Inc
5962-91677

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
50 ns
72K (8K x 9)

5962-9312402MYA
7C453-20/MYA
Teledyne e2v Inc
5962-93124

Compare DCL / BOM Cart
QML Q
Not qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-32
20 ns
18K (2K x 9)

5962-8866902UA
CY7C429-65KMB
Teledyne e2v Inc
5962-88669

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CFP-28
65 ns
18K (2K x 9)

5962-8866906XA
CY7C428-20DMB
Teledyne e2v Inc
5962-88669

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
20 ns
18K (2K x 9)

5962-9158503MXA
CY7C425-65DMB
Teledyne e2v Inc
5962-91585

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
65 ns
9K (1K x 9)
Part validation activities
Cost & Activity Matrix
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