Servicio Familia 
Bond Pull Test for FIFO Memory
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for FIFO Memory
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
459 results found for FIFO/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
15 ns
288K (32K x 9)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
20 ns
18K (2K x 9)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
20 ns
288K (32K x 9)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
20 ns
36K (4K x 9)
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
LQFP-80
133 ns
288K (16K x 18 / 32K x 9)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
50 ns
72K (8K x 9)
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CQLCC-32
20 ns
18K (2K x 9)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-28
65 ns
18K (2K x 9)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
20 ns
18K (2K x 9)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
65 ns
9K (1K x 9)
Part validation activities
Cost & Activity Matrix