


Cross Sectioning for EEPROM Memory
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for EEPROM Memory
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
1532 results found for EEPROM/ROM/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-32
250 ns
1M (128K x 8)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
HIP-66
300 ns
4M (128K x 32)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-32
250 ns
4M (512K x 8)
883
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-20
60 ns
4K (512 x 8)
QML H
Qualified
QPDSIS-38534
Surface Mount
CQFP-68
200 ns
4M (128K x 32)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-32
150 ns
1M (128K x 8)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
HIP-66 (With Standoffs)
300 ns
4M (128K x 32)
QML H
Qualified
QPDSIS-38534
Surface Mount
CQFP-68
250 ns
4M (128K x 32)
QML H
Qualified
QPDSIS-38534
Surface Mount
CQFP-68
300 ns
4M (128K x 32)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-40
300 ns
2M (128K x 16)
Part validation activities
Cost & Activity Matrix