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Bond Pull Test for EEPROM Memory
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for EEPROM Memory
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1530 results found for EEPROM/ROM/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-40
200 ns
2M (128K x 16)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
200 ns
64K (8K x 8)
883
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
150 ns
64K (8K x 8)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
HIP-66 (With Standoffs)
120 ns
1M (32K x 32)
QML H
Qualified
QPDSIS-38534
Surface Mount
CQFP-68
90 ns
1M (32K x 32)
QML H
Qualified
QPDSIS-38534
Surface Mount
CQFP-68
120 ns
1M (32K x 32)
QML H
Qualified
QPDSIS-38534
Surface Mount
CQFP-68
150 ns
4M (128K x 32)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
HIP-66 (With Standoffs)
250 ns
4M (128K x 32)
QML H
Not qualified
QPDSIS-38534
Surface Mount
CQFP-68 (Gull Wing)
200 ns
4M (128K x 32)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
HIP-66 (With Standoffs)
250 ns
4M (128K x 32)
Part validation activities
Cost & Activity Matrix