Servicio Familia 
Bond Pull Test for Divider-Prescaler-Counter
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Divider-Prescaler-Counter
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
21 results found for Divider Prescaler and Counter/Frequency Conversion/RF-Microwave Microcircuits/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-8 (Gull Wing)
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-8 (Gull Wing)
SPACE
Not qualified
ADI Space QPL
Surface Mount
FP-8
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-8 (Gull Wing)
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-8 (Gull Wing)
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-8 (Gull Wing)
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-8 (Gull Wing)
SPACE
Not qualified
ADI Space QPL
Surface Mount
CFP-8
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-8 (Gull Wing)
Part validation activities
Cost & Activity Matrix