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Bond Pull Test for Digital Signal Processor
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Digital Signal Processor
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
111 results found for Digital Signal Processor/Processor/Digital/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CPGA-325
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQFP-352
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
PBGA-532
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
PBGA-337
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
PBGA-697
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
CBGA-144
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
PBGA-361
QML Q
Not qualified
QPDSIS-38535
DIE
DIE
QML Q
Qualified
QPDSIS-38535
DIE
DIE
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQFP-352
Part validation activities
Cost & Activity Matrix