Servicio Familia 
Bond Pull Test for Digital Arithmetic ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Digital Arithmetic ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
422 results found for Arithmetic/Logic/Digital/Microcircuits
Part reference
Quality level / QPL
Package
Type
TID (krads)
SEE (MeV/mg/cm2)
Delay Time [Max]
Number of Bits
Number of Elements
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-14
Parity Generator and Checker
17ns
9-Bits
1
JAN B
Qualified
QPDSIS-38535
Surface Mount
CFP-24
ALU/Function Generator
80ns
4-Bits
1
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
Parity Generator and Checker
235ns
9-Bits
1
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
Full Adder
36ns
1-Bits
2
JAN B
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
Parity Generator and Checker
21ns
9-Bits
1
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
Parity Generator and Checker
17ns
9-Bits
1
JAN B
Qualified
QPDSIS-38535
Surface Mount
CFP-16
Full Adder
14ns
4-Bits
1
JAN B
Qualified
QPDSIS-38535
Surface Mount
CFP-14
Parity Generator and Checker
21ns
9-Bits
1
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20