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Cross Sectioning for Data Acquisition System
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Data Acquisition System
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
47 results found for Data Acquisition System/Data Converter/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
QML V
Qualified
QPDSIS-38535
Surface Mount
CQFP-68
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-40
MLS
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-68
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-8
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-20
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-20
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-40
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-28
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-40
MECH SAMPLE
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-68
Part validation activities
Cost & Activity Matrix