


Cross Sectioning for DRAM Memory
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for DRAM Memory
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
228 results found for DRAM/RAM/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
ZIP-28
30 ns
1M (256K x 4)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-50
12 ns
8M (512K x 16)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-18
80 ns
4M (4M x 1)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-20
100 ns
1M (256K x 4)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CSOJ-20
100 ns
1M (256K x 4)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-50
20 ns
8M (512K x 16)
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
SOP-58
TID (HDR): 50.0
SEL (Let): 80.0
SEU (Let): 7.0
7ns
4G (512M x 8)
EM (3 Temp)
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-72
6 ns
256M (16M x 4 x 4)
EM (3 Temp)
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-132
6 ns
1G (8M x 32 x 4)
EM (3 Temp)
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-132
6 ns
1G (8M x 32 x 4)
Part validation activities
Cost & Activity Matrix