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Cross Sectioning for DRAM Memory

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

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EEE Parts Results Page

Cross Sectioning for DRAM Memory

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

Applications expected requirements
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  • Microcircuits
    • Digital
      • Memory
        • RAM
          • DRAM

228 results found for DRAM/RAM/Memory/Digital/Microcircuits

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Part reference
Quality level / QPL
TOP
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time

5962-9674302QXA
SMJ416160-70HKDM
Micross Components
5962-96743

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CFP-50
70 ns
16M (1M x 16)

5962-8949703MMA
SMJ44C251B-12SVM
Micross Components
5962-89497

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
ZIP-28
35 ns
1M (256K x 4)

5962-8949703MZA
SMJ44C251B-12HMM
Micross Components
5962-89497

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CDLCC-28
35 ns
1M (256K x 4)

48SD6404RPFH
48SD6404RPFH
DDC formerly Maxwell Microelectronics
MFR DS 48SD6404

Compare DCL / BOM Cart
CLASS H EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-72
TID (HDR): 100.0
SEL (Let): 85.0
6 ns
256M (16M x 4 x 4)

72SD3232RPFK
72SD3232RPFK
DDC formerly Maxwell Microelectronics
MFR DS 72SD3232

Compare DCL / BOM Cart
CLASS K EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-72
TID (HDR): 100.0
SEL (Let): 85.0
6 ns
4G (32M x 32 x 4)

97SD3248RPQH
97SD3248RPQH
DDC formerly Maxwell Microelectronics
MFR DS 97SD3248

Compare DCL / BOM Cart
CLASS H EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CQFP-132
TID (HDR): 100.0
SEL (Let): 85.0
6 ns
1G (8M x 32 x 4)

48SD3208RPFH
48SD3208RPFH
DDC formerly Maxwell Microelectronics
MFR DS 48SD3208

Compare DCL / BOM Cart
CLASS H EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-72
TID (HDR): 100.0
SEL (Let): 85.0
6 ns
256M (8M x 8 x 4)

48SD3208RPFK
48SD3208RPFK
DDC formerly Maxwell Microelectronics
MFR DS 48SD3208

Compare DCL / BOM Cart
CLASS K EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-72
TID (HDR): 100.0
SEL (Let): 85.0
6 ns
256M (8M x 8 x 4)

OCE1D4G72VB239EE2T07
OCE1D4G72VB239EE2T07
OCE Technology
MFR SPEC OCE1D4G72xB239xx2Txx

Compare DCL / BOM Cart
EM
Not qualified
NOT LISTED IN QPL
0ºC to +70ºC
Surface Mount
PBGA-239
7ns
4,5G (64M x 72)

OCE1D4G72RB239SS2T06
OCE1D4G72RB239SS2T06
OCE Technology
MFR SPEC OCE1D4G72xB239xx2Txx

Compare DCL / BOM Cart
SPACE
Not qualified
NOT LISTED IN QPL
-45ºC to +105ºC
Surface Mount
PBGA-239
6ns
4,5G (64M x 72)
Part validation activities
Cost & Activity Matrix
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