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Bond Pull Test for DRAM Memory
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for DRAM Memory
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
228 results found for DRAM/RAM/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-20
120 ns
1M (256K x 4)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CSOJ-20
150 ns
1M (256K x 4)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CDLCC-20
70 ns
1M (256K x 4)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CSOJ-20
80 ns
1M (256K x 4)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CDLCC-20
120 ns
1M (256K x 4)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CSOJ-20
120 ns
1M (256K x 4)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CDCC-28 (J-Lead)
35 ns
1M (256K x 4)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CDCC-28 (J-Lead)
35 ns
1M (256K x 4)
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
SOP-58
TID (HDR): 50.0
SEL (Let): 80.0
SEU (Let): 7.0
7ns
4G (512M x 8)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-50
80 ns
16M (1M x 16)
Part validation activities
Cost & Activity Matrix