


Cross Sectioning for DA Converters
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for DA Converters
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
402 results found for Digital to Analog Converters/Data Converter/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
AEC-Q
Qualified
AEC-Q100
GOLD
Surface Mount
SOT-23-6
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-14
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SSOP-28
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-24
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
HTQFP-48
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-24
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-20
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-8
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-20
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-20
Part validation activities
Cost & Activity Matrix