Servicio Familia 
Bond Pull Test for DA Converters
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for DA Converters
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
402 results found for Digital to Analog Converters/Data Converter/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
AEC-Q
Qualified
AEC-Q100
GOLD
Surface Mount
SOT-23-6
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-14
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SSOP-28
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-24
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
HTQFP-48
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-8
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-20
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-16
QML Q
Not qualified
QPDSIS-38535
Through Hole Mount
CDIP-24
QML V
Qualified
QPDSIS-38535
Surface Mount
CCGA-255
Part validation activities
Cost & Activity Matrix