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Bond Pull Test for Custom Inductors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Custom Inductors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1 results found for Custom Inductors/Inductors
Part reference
Quality level / QPL
Package
Inductance [Nom]
Rated Current
Unit price
Lead time
ESCC
Qualified
ESCC QPL
Customised Mount
Custom
Custom
Part validation activities
Cost & Activity Matrix