Servicio Familia 
Cross Sectioning for Current Source ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Current Source ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
22 results found for Current Source/Power Management/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
PROTO
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-4
QML K
Qualified
QPDSIS-38534
Surface Mount
CQFP-40
TID (HDR): 100.0
TID (LDR): 15.0
QML K
Qualified
QPDSIS-38534
Surface Mount
CFP-18
QML K
Qualified
QPDSIS-38534
Surface Mount
CFP-18
TID (HDR): 100.0
TID (LDR): 15.0
QML K
Qualified
QPDSIS-38534
Surface Mount
CFP-18
PROTO
Not qualified
NOT LISTED IN QPL
Evaluation Board
Evaluation Board
TID (HDR): 0.0
QML V
Qualified
QPDSIS-38535
DIE
DIE
TID (HDR): 100.0
TID (LDR): 50.0
SEL (Let): 86.0
TESTED DIE
Not qualified
NOT LISTED IN QPL
DIE
DIE
TID (HDR): 0.0
TESTED DIE
Not qualified
NOT LISTED IN QPL
DIE
DIE
TID (HDR): 0.0
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-4
TID (HDR): 100.0
TID (LDR): 50.0
SEL (Let): 86.0
Part validation activities
Cost & Activity Matrix